The Proscan
non-contact surface 3D surface measurement instrument for measurement of
features on QFP components such as BGA, Micro-BGA and flip chips can be
accurately measured to show information such as coplanarity, ball position,
ball height and warpage on the package. The Proscan 3D surface measurement
instrument can measure laser etch depth to sub micron level and lead
coplanarity of QFP packages.
The Proscan electronic component inspection system incorporates the very latest non-contact sensor technology for accurate control of dimensional parameters on electronic components. Emphasis is placed in combining speed and accuracy to produce true surface profiles of components, making it possible to produce greater reliability and reduce product failure.
100% inspection of BGA (including fine pitch) and Flipchip packages with automatic analysis of coplanarity, ball height, ball position and package
warpage.
Wirebond analysis of loop height and bond profile.
Laser etch measurement to sub-micron resolution reported as true 3D mean, max and min depths.
Fast, accurate warpage measurement offering reliable information of the product reliability.
Qualified results for assessment of adhesive qualities on contacts using contact surface roughness.
Lead coplanarity inspection checks for product performance when placed on PCB or QFP.
Thick and thin film measurement on printed and sputtered materials including prints on flexible and transparent substrates.
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